Technology

The technology we have acquired through magnetic disk manufacturing equipment can be used in a variety of manufacturing.In the future, we will expand the range of applications by looking at industries other than the magnetic disk manufacturing field.

We specially design according to the customer's products, usage conditions and requirements

01. Convey

01. Convey

• Usage environment
  Corrosion resistant environment, Clean environment, High temperature environment
• Drive equipment
  Horizontal / Multi joint robot, Single-axis robot, Linear motor single-axis robot, Orthogonal robot, Air cylinder, Mitsubishi, DENSO, YAMAHA, IAI, Oriental Motor, SMC, Koganei, CKD, Yaskawa Electric, Harmonic Drive Systems
• Work gripping method
  Electric chuck, Air chuck, Vacuum chuck
• Conveyor type
  Straight, Loop, Belt conveyor, Roller conveyor, Walking beam, Direct transfer, Pallet transfer, Cassette transfer, Underwater transfer, Clean transfer

02. Grind

02. Grind

• Double-sided grinder for HDD substrate
  3way(3motor), All-axis servo, Simultaneous start and stop, Fixed position stop, Fixed size grinding, PVA grindstone, Slurry, Carrier size 11B, Platen outer diameter 1300 mm
• Single-sided grinder for wafer
  Fixed grains, In-feed grinder, Vacuum chuck, Air spindle, Auto size control, Wafer size 4-12 inches

03. Polish

03. Polish

• Double-sided lapping machine
  4way(4motor), All-axis servo, Simultaneous start and stop, Fixed position stop, Casting platen, Slurry, Carrier size 26B, platen outer diameter 1800 mm
• Single-sided lapping machine
  Facing, Metal platen, Resin platen, KEMET copper platen
• Single-sided polisher
  All-axis servo, Small load, Oscillation, Automatic charging, Slurry flow rate monitoring, Slurry remaining rate control
• Single-sided CMP machine
  Large load, High stiffness, Wafer size 2 -12 inches, Slurry supply unit, Washing unit
• Double-sided polisher for HDD substrate
  3way(3motor), All-axis servo, Simultaneous start and stop, Fixed position stop, Loose grains, Slurry, Carrier size 11B, platen outer diameter 1300 mm, High pressure water pad washing, Stainless steel platen, Platen profile designation, Light load, High following, Work separate system
• Double-sided polisher for glass substrate
  4way(4motor), All-axis servo, simultaneous start and stop, Fixed position stop, Loose grains, Slurry, Carrier size 13B, platen outer diameter 1500 mm
• Double-sided polisher
  4way(4motor), All-axis servo, Simultaneous start and stop, Fixed position stop, Loose grains, Slurry, Carrier size 26B, platen outer diameter 1800 mm

04. Wash

04. Wash

• Washer for semiconductors
  Single-sided washing, Double-sided washing, PVA sponge, Modular brush, Ultrasonic shower, Acid washing, Alkaline washing
• Double-sided scrub washer for HDD substrate
  Double-sided scrub washing, Inner and outer circumference washing, Inner and outer circumference washing Deionized water washing, Chemical washing, Spin drying, PVA sponge brush
• Ultrasonic DIP type washer for HDD substrate
  170kHz, 430kHz, 950kHz, Electropolishing SUS316 water tank

05. Watch

05. Watch

• Laser and wavelength according to inspection objects and defects
  405nm、458nm, 488nm, 532nm, 561nm, 632.8nm, 780nm, purple, blue, yellow, green, red
• Inspection according to the material of the inspection objects
  Metal, Glass, Si, Sic, Ceramic, Compound
• Optical scanning according to the type and size of the inspection objects
  Spiral scan, Progressive scan, Raster scan, Transparent, Translucent, Mirror surface, Circular shape, Square shape, Flat surface
• Photodetector according to the light information
  
• Optical characteristics applied according to the inspection objects and defects
  Elastic scattering, Inelastic scattering, Geometric scattering, Mie scattering, Rayleigh sccattering, Luminescent, Raman scattering, Photoluminescence (PL), Reflection, Absorption, Absorption, Polarization, Phase waves, Interfelence, Photoelasticity, Polarization, Phase waves, Interfelence, Photoelasticity
• Defects detected according to the defect type and shape
  Particle, Stain, Scratch, bumps, Wave unduration
• Proposal of original equipment according to the purpose of inspection
• Design original inspection programs and algorithms
  Programming language / development environment [C ,, C #, C ++, Visual Basic / Visual Studio]
• classification by measuring flatness
  Eddy current sensor
• classification by measuring thickness
  Laser displacement sensor, spectroscopic interference displacement sensor, 1 μm sorting, 0.5 μm sorting, 16 ranks sorting, high-speed sorting

06. Control

06. Control

• Control product incoming/outgoing and production data using IC tags and barcodes (traceability)
  RF tags, RFID, Code39, Code128, Code11 etc
• Collective control production yield and product quality in real time by connecting machines
• Design an original control system to meet customer needs
  Programming language / development environment [C ,, C #, C ++, Visual Basic / Visual Studio]
• Cooperation with customer host server
  SEMI standard, CSV file data
• Operation status control
  Data logger, overload, water leakage, temperature, rotation speed, pressure, torque, load, flow rate

07. Connect

07. Connect

• Select various communication standards according to the application
  Serial communication (RS232c, RS485, etc.), Ethernet, CC-Link, MX-component, SSCNET (Mitsubishi)
• Control equipment
  Mitsubishi, KEYENCE, FANUC, Windows, Fuji Electric, IDEC
• Touch panel
  Mitsubishi, Digital, KEYENCE, HAKKO
• connect
  connecting regardless of SSC machine s or not, Systematizing production line (ex) Conveyor + polisher + washer / dryer + inspection machine + conveyor
• safety
  Interlock, safety fences, area sensors, risk assessment

Others

Others

• Wafer pasting machine
  Balloon method, Heater, Water cooling, PID control (temperature control), Recipe operation, Low vacuum