|1986||Entry into the hard disk related equipment business|
|1989||Hard disk Grinding/Polishing/Cleaning/Drying automatio line Unit 1 released|
|1990||Automatic visual inspection system for hard disk substrate (CCD method) released.|
|1992||The first integrated hard disk production line is released. (Development of plating racking and unracking equipment)|
|1993||Hard disk lathe Unit 1 released.|
|1994||Releasing the first laser type disc surface inspection system, SSI series.|
|1995||Completed the development of an integrated super-polishing line. Entry into LCD related equipment business. LCD cassette washer release|
|1996||Disk thickness sorting system Unit 1 released.|
System Seiko (Malaysia) Sdn. Bhd. established.
Disk flatness inspection system Unit 1 released: SFI series
Disk surface defect analysis system Unit 1 released: SDA series (detection sensitivity: 5μm)
Super grinder, Ultra polisher release
Disk surface inspection "Head V8.0" (Detection sensitivity: 1μm) released.
System Seiko (Malaysia) Sdn. Bhd. relocated to Kulim area (current office).
Automated hard disk precision polishing line release for glass (4-way system): 13B-10P
Precision cleaning machine release
Disk surface inspection head "V8.0A" (Detection sensitivity 300nm) release.
|2000||Hard disk chamfer grinding and polishing machine for glass released|
Semiconductor wafer cleaning machine released.
Double-sided thin film polishing machines for compound and oxide wafers released： PH1500/1800 Series
Glass disk surface inspection head Ver.9.0 released. (Detection sensitivity: 1μm)
Disk surface inspection system "SSI-641" released.
Signal processing system released. (for Windows)
|2010||Disk surface inspection device "SSI-642" released.|
Signal processing system released. (for digital signal processing)
Disk surface inspection head "V820" (Detection sensitivity: 80nm) released.
|2013||Foreign material inspection and analysis system for rectangular substrates "RSI series" released.|
Transferred shares to Kemet Japan Co.,Ltd.
Became a member of the Kemet Japan Group.
Release of LSI series, flat surface inspection system for large-size substrates.
Inspection optical head Ver.1000 (Detection sensitivity 50nm) experimental equipment release.
Thickness sorter equipment released.
Optical scanning device, optical scanning method and surface inspection device released. (Patented)
Wafer wax lamination system released.
Single side polishing system with low pressure function released.
Commissioned by MAT Division of Kemet Japan to produce and maintain the equipment.
Fully automatic CMP system with cleaning function released.
|2020||Wafer cleaning machine release.|
|2023||Transferred shares to Kitagawa Corporation
Became a member of Kitagawa Group.