History

History

Sep.1978 Establishment
1986 Entry into the hard disk related equipment business
1989 Hard disk Grinding/Polishing/Cleaning/Drying automatio line Unit 1 released
1990 Automatic visual inspection system for hard disk substrate (CCD method) released.
1992 The first integrated hard disk production line is released. (Development of plating racking and unracking equipment)
1993 Hard disk lathe Unit 1 released.
1994 Releasing the first laser type disc surface inspection system, SSI series.
1995 Completed the development of an integrated super-polishing line. Entry into LCD related equipment business. LCD cassette washer release
1996 Disk thickness sorting system Unit 1 released.
1997 System Seiko (Malaysia) Sdn. Bhd. established.
Disk flatness inspection system Unit 1 released: SFI series
Disk surface defect analysis system Unit 1 released: SDA series (detection sensitivity: 5μm)
1998 Super grinder, Ultra polisher release
Disk surface inspection "Head V8.0" (Detection sensitivity: 1μm) released.
System Seiko (Malaysia) Sdn. Bhd. relocated to Kulim area (current office).
Automated hard disk precision polishing line release for glass (4-way system): 13B-10P
Precision cleaning machine release
Disk surface inspection head "V8.0A" (Detection sensitivity 300nm) release.
2000 Hard disk chamfer grinding and polishing machine for glass released
2001 Semiconductor wafer cleaning machine released.
Double-sided thin film polishing machines for compound and oxide wafers released: PH1500/1800 Series
Glass disk surface inspection head Ver.9.0 released. (Detection sensitivity: 1μm)
2005 Disk surface inspection system "SSI-641" released.
Signal processing system released. (for Windows)
2010 Disk surface inspection device "SSI-642" released.
Signal processing system released. (for digital signal processing)
Disk surface inspection head "V820" (Detection sensitivity: 80nm) released.
2013 Foreign material inspection and analysis system for rectangular substrates "RSI series" released.
2014 Transferred shares to Kemet Japan Co.,Ltd.
Became a member of the Kemet Japan Group.
2017 Release of LSI series, flat surface inspection system for large-size substrates.
Inspection optical head Ver.1000 (Detection sensitivity 50nm) experimental equipment release.
Thickness sorter equipment released.
2018 40th Anniversary
Optical scanning device, optical scanning method and surface inspection device released. (Patented)
Wafer wax lamination system released.
Single side polishing system with low pressure function released.
2019 Commissioned by MAT Division of Kemet Japan to produce and maintain the equipment.
Fully automatic CMP system with cleaning function released.
2020 Wafer cleaning machine release.