History
History
| Sep.1978 | Establishment |
|---|---|
| 1986 | Entry into the hard disk related equipment business |
| 1989 | Hard disk Grinding/Polishing/Cleaning/Drying automatio line Unit 1 released |
| 1990 | Automatic visual inspection system for hard disk substrate (CCD method) released. |
| 1992 | The first integrated hard disk production line is released. (Development of plating racking and unracking equipment) |
| 1993 | Hard disk lathe Unit 1 released. |
| 1994 | Releasing the first laser type disc surface inspection system, SSI series. |
| 1995 | Completed the development of an integrated super-polishing line. Entry into LCD related equipment business. LCD cassette washer release |
| 1996 | Disk thickness sorting system Unit 1 released. |
| 1997 |
System Seiko (Malaysia) Sdn. Bhd. established. Disk flatness inspection system Unit 1 released: SFI series Disk surface defect analysis system Unit 1 released: SDA series (detection sensitivity: 5μm) |
| 1998 |
Super grinder, Ultra polisher release Disk surface inspection "Head V8.0" (Detection sensitivity: 1μm) released. |
|
System Seiko (Malaysia) Sdn. Bhd. relocated to Kulim area (current office). Automated hard disk precision polishing line release for glass (4-way system): 13B-10P Precision cleaning machine release Disk surface inspection head "V8.0A" (Detection sensitivity 300nm) release. |
|
| 2000 | Hard disk chamfer grinding and polishing machine for glass released |
| 2001 |
Semiconductor wafer cleaning machine released. Double-sided thin film polishing machines for compound and oxide wafers released： PH1500/1800 Series Glass disk surface inspection head Ver.9.0 released. (Detection sensitivity: 1μm) |
| 2005 |
Disk surface inspection system "SSI-641" released. Signal processing system released. (for Windows) |
| 2010 | Disk surface inspection device "SSI-642" released. |
|
Signal processing system released. (for digital signal processing) Disk surface inspection head "V820" (Detection sensitivity: 80nm) released. |
|
| 2013 | Foreign material inspection and analysis system for rectangular substrates "RSI series" released. |
| 2014 |
Transferred shares to Kemet Japan Co.,Ltd. Became a member of the Kemet Japan Group. |
| 2017 |
Release of LSI series, flat surface inspection system for large-size substrates. Inspection optical head Ver.1000 (Detection sensitivity 50nm) experimental equipment release. Thickness sorter equipment released. |
| 2018 |
40th Anniversary Optical scanning device, optical scanning method and surface inspection device released. (Patented) Wafer wax lamination system released. Single side polishing system with low pressure function released. |
| 2019 |
Commissioned by MAT Division of Kemet Japan to produce and maintain the equipment. Fully automatic CMP system with cleaning function released. |
| 2020 | Wafer cleaning machine release. |
| 2023 | Transferred shares to Kitagawa Corporation Became a member of Kitagawa Group. |